|
9 Disco Diamond Dicing Cut-Off Wheel/Blade P1A851 NBC-ZH/ZHT series provides high productivity and excellent process results thanks to its superb cutting ability and long life. DISCO's dicing blades are used with dicing and cutting saws to groove, cut, and dice silicon, compound semiconductors, glass, ceramics, crystals, and almost any other material. The NBC-ZH/ZHT series is produced using DISCO's original technology. A combination of an ultra-thin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results. In combination with DISCO's vast application knowledge, these blades provide excellent cutting results when dicing silicon wafers and compound semiconductor wafers such as GaAs. * Advanced dicing process - bevel and step cutting * Wide range of grit sizes and bond types to support various application requirements * Shorter blade change time - increased productivity - 9 x Disco Diamond Blade P1A851; Size 76.2mm x 0.25mm x 40mm (9 disco diamond dicing cut-off wheel/blade P1A851 was posted and is owned by: Isaac Schmidt) |
I-schmidt@chicagopartsnetwork.com (Isaac Schmidt) for more information.
