These MCPCB's are new and designed for the Cree XLAMP series LED. This PCB has very high dielectric thermal conductivity at 27 W/m-K compared to - 2. Polymer/Ceramic = 1.3 - 2.2 W/m-K 3. Thermally Conductive Pre-preg = 3 W/m-K Board dimensions - 1.5" X 11.9" Trace - Silver and /or silver alloy Nominal Trace Thickness - 20 um Dielectric Thermal Conductivity 27 W/m-K Max. Operating Voltage - 250 VAC Thermal Impedance 0.02 C/W (pad to aluminum core , pad size = 0.1 sq. in.) PCB has foot print for SOT-223 regulator and passive component for regulator. Mounting holes are 6 X 0.125" Diameter. Solder stencil file in gerber format available upon request. ** The trace being silver requires a solder that has silver content such as (New metal core pcb for cree xlamp xre and xr was posted and is owned by: Rhoda Bolton) |
rhoda.bolton@chicagopartsnetwork.com (Rhoda Bolton)
for more information.