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5X Disco Diamond Cut-Off Dicing Wheel/Blade ZBT-1009 NBC-Z/ZBT series blades are a result of DISCO's original blade development. These blades employ electroformed bonds that realize superb cutting quality and blade life. In addition to dicing semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages. The structural strength of the blade allows for ultra-thin blades to be realized. They are suitable for dicing and deep grooving of narrow streets. By changing the lateral face of the blades, surface chipping and slanted cuts are minimized. This results in improved cutting quality. * Deep cutting and grooving are possible using super-thin blades. * Blade thickness - 0.015 mm to 0.3 mm * Wide range of grit sizes and bond types are available to meet application requirements * Available for both dicing saws and slicers - 4 x ZBT-1009 ZB1110-VS4 Size 76.2 x 0.25 x 52 mm - 3 x NBC-Z 2030L Size 76.2 x 0.2 x 40 mm (5X disco diamond cut-off dicing wheel/blade zbt-1009 was posted and is owned by: Jennifer Gray) |
Jennifer_gray@chicagopartsnetwork.com (Jennifer Gray) for more information.
